PCB抄板工藝的一些小原則有哪些？下面為大家分享：

 1：印刷(shua)導(dao)線(xian)(xian)(xian)(xian)(xian)(xian)寬度(du)(du)選(xuan)擇(ze)依據：印刷(shua)導(dao)線(xian)(xian)(xian)(xian)(xian)(xian)的(de)最小(xiao)寬度(du)(du)與(yu)流過導(dao)線(xian)(xian)(xian)(xian)(xian)(xian)的(de)電(dian)(dian)流大(da)(da)小(xiao)有關(guan)：線(xian)(xian)(xian)(xian)(xian)(xian)寬太小(xiao)，剛印刷(shua)導(dao)線(xian)(xian)(xian)(xian)(xian)(xian)電(dian)(dian)阻大(da)(da)，線(xian)(xian)(xian)(xian)(xian)(xian)上的(de)電(dian)(dian)壓(ya)降也(ye)就大(da)(da)，影響電(dian)(dian)路的(de)性(xing)能(neng)(neng)，線(xian)(xian)(xian)(xian)(xian)(xian)寬太寬，則布線(xian)(xian)(xian)(xian)(xian)(xian)密度(du)(du)不高，板(ban)面積增(zeng)加(jia)，除(chu)了增(zeng)加(jia)成本(ben)外，也(ye)不利于小(xiao)型化。如果電(dian)(dian)流負荷以(yi)20A/平方(fang)毫米(mi)計算，當(dang)覆銅箔厚度(du)(du)為(wei)0.5MM時，(一般為(wei)這么多(duo)，)則1MM(約40MIL)線(xian)(xian)(xian)(xian)(xian)(xian)寬的(de)電(dian)(dian)流負荷為(wei)1A，因此(ci)，線(xian)(xian)(xian)(xian)(xian)(xian)寬取1——2.54MM(40——100MIL)能(neng)(neng)滿(man)(man)足一般的(de)應用要求，大(da)(da)功(gong)率設(she)備板(ban)上的(de)地線(xian)(xian)(xian)(xian)(xian)(xian)和(he)電(dian)(dian)源，根據功(gong)率大(da)(da)小(xiao)，可(ke)適當(dang)增(zeng)加(jia)線(xian)(xian)(xian)(xian)(xian)(xian)寬，而在小(xiao)功(gong)率的(de)數字(zi)電(dian)(dian)路上，為(wei)了提高布線(xian)(xian)(xian)(xian)(xian)(xian)密度(du)(du)，最小(xiao)線(xian)(xian)(xian)(xian)(xian)(xian)寬取0.254——1.27MM(10——15MIL)就能(neng)(neng)滿(man)(man)足。同一電(dian)(dian)路板(ban)中，電(dian)(dian)源線(xian)(xian)(xian)(xian)(xian)(xian)。地線(xian)(xian)(xian)(xian)(xian)(xian)比(bi)信號線(xian)(xian)(xian)(xian)(xian)(xian)粗(cu)。

  2：線(xian)間距(ju)(ju)：當為(wei)(wei)1.5MM(約(yue)為(wei)(wei)60MIL)時，線(xian)間絕緣電(dian)(dian)(dian)阻大于20M歐，線(xian)間耐壓(ya)可達300V，當線(xian)間距(ju)(ju)為(wei)(wei)1MM(40MIL)時，線(xian)間耐壓(ya)為(wei)(wei)200V，因此，在(zai)中低壓(ya)(線(xian)間電(dian)(dian)(dian)壓(ya)不(bu)大于200V)的電(dian)(dian)(dian)路板上(shang)，線(xian)間距(ju)(ju)取1.0——1.5MM (40——60MIL)在(zai)低壓(ya)電(dian)(dian)(dian)路，如(ru)數字電(dian)(dian)(dian)路系統(tong)中，不(bu)必(bi)考(kao)慮擊穿電(dian)(dian)(dian)壓(ya)，只(zhi)要生(sheng)產工藝允許，可以很小(xiao)。

  3：焊(han)盤(pan)：對于1/8W的電阻來說，焊(han)盤(pan)引線(xian)直徑(jing)為28MIL就足(zu)夠(gou)了，而對于1/2W的來說，直徑(jing)為32MIL，引線(xian)孔(kong)偏大，焊(han)盤(pan)銅(tong)環寬度相對減(jian)小，導致(zhi)焊(han)盤(pan)的附著力(li)下降。容易脫落，引線(xian)孔(kong)太小，元件播(bo)裝困難(nan)。

  4：畫電路邊(bian)(bian)框(kuang)：邊(bian)(bian)框(kuang)線與元件引腳焊盤最短距離不能小于2MM，(一(yi)般取5MM較合理)否則下料困難。

  5：元件布(bu)局原則(ze)(ze)：A：一般(ban)原則(ze)(ze)：在(zai)PCB設計中，如果(guo)電(dian)路(lu)系統同時存(cun)在(zai)數(shu)字電(dian)路(lu)和模擬電(dian)路(lu)。以及大電(dian)流(liu)電(dian)路(lu)，則(ze)(ze)必須分開布(bu)局，使各系統之間藕合達到最小在(zai)同一類型電(dian)路(lu)中，按(an)信(xin)號流(liu)向及功(gong)能，分塊，分區放置元件。

  6：輸入信號(hao)處理單元，輸出信號(hao)驅動(dong)元件應靠近電路板邊，使輸入輸出信號(hao)線盡可能短，以減(jian)小輸入輸出的(de)干擾。

  7：元件放置方向：元件只能沿水平和垂直兩(liang)個方向排(pai)列(lie)。否則不得于插件。

  8：元(yuan)(yuan)件(jian)(jian)(jian)間(jian)距。對(dui)于中等密度板，小元(yuan)(yuan)件(jian)(jian)(jian)，如小功率電(dian)阻，電(dian)容，二極管，等分(fen)立(li)元(yuan)(yuan)件(jian)(jian)(jian)彼(bi)此的間(jian)距與插件(jian)(jian)(jian)，焊(han)接工藝有關，波峰焊(han)接時，元(yuan)(yuan)件(jian)(jian)(jian)間(jian)距可以取(qu)50-100MIL(1.27——2.54MM)手工可以大些，如取(qu)100MIL，集成電(dian)路芯片，元(yuan)(yuan)件(jian)(jian)(jian)間(jian)距一般為100——150MIL。

  9：當元件間電(dian)位差較(jiao)大(da)時，元件間距應(ying)足夠(gou)大(da)，防止出現(xian)放(fang)電(dian)現(xian)象。

  10：在(zai)而已(yi)進IC去藕(ou)電(dian)(dian)容(rong)(rong)(rong)要(yao)靠近芯(xin)片(pian)(pian)的(de)(de)電(dian)(dian)源(yuan)秋地(di)線(xian)引(yin)腳。不然濾波效果會(hui)變(bian)差。在(zai)數字電(dian)(dian)路(lu)中(zhong)，為保(bao)證(zheng)數字電(dian)(dian)路(lu)系(xi)統可靠工作，在(zai)每一(yi)數字集成(cheng)電(dian)(dian)路(lu)芯(xin)片(pian)(pian)的(de)(de)電(dian)(dian)源(yuan)和地(di)之(zhi)間均放置IC去藕(ou)電(dian)(dian)容(rong)(rong)(rong)。去藕(ou)電(dian)(dian)容(rong)(rong)(rong)一(yi)般(ban)(ban)采用瓷片(pian)(pian)電(dian)(dian)容(rong)(rong)(rong)，容(rong)(rong)(rong)量(liang)為0.01~0.1UF去藕(ou)電(dian)(dian)容(rong)(rong)(rong)容(rong)(rong)(rong)量(liang)的(de)(de)選擇(ze)(ze)一(yi)般(ban)(ban)按系(xi)統工作頻率F的(de)(de)倒數選擇(ze)(ze)。此外，在(zai)電(dian)(dian)路(lu)電(dian)(dian)源(yuan)的(de)(de)入口處的(de)(de)電(dian)(dian)源(yuan)線(xian)和地(di)線(xian)之(zhi)間也需加接一(yi)個10UF的(de)(de)電(dian)(dian)容(rong)(rong)(rong)，以(yi)及一(yi)個0.01UF的(de)(de)瓷片(pian)(pian)電(dian)(dian)容(rong)(rong)(rong)。

 11：時(shi)針電路(lu)元件盡量靠近單片機芯片的時(shi)鐘信(xin)號引腳，以減小時(shi)鐘電路(lu)的連(lian)線長度。且下面不要走線。